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TPS2069CDGNR Datasheet(PDF) 4 Page - Texas Instruments

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No. de Pieza. TPS2069CDGNR
Descripción  Current Limited, Power-Distribution Switches
Descarga  39 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS2069CDGNR Datasheet(HTML) 4 Page - Texas Instruments

 
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1
GND
8
OUT
2
IN
7
OUT
3
IN
6
OUT
4
EN/EN
5
FLT
1
GND
8
OUT
2
IN
7
OUT
3
IN
6
OUT
4
EN/EN
5
FLT
PowerPAD
4
TPS2000C, TPS2001C, TPS2041C, TPS2051C, TPS2061C
TPS2065C, TPS2065C-2, TPS2068C, TPS2069C, TPS2069C-2
SLVSAU6H – JUNE 2011 – REVISED APRIL 2016
www.ti.com
Product Folder Links: TPS2000C TPS2001C TPS2041C TPS2051C TPS2061C TPS2065C TPS2065C-2 TPS2068C
TPS2069C TPS2069C-2
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Copyright © 2011–2016, Texas Instruments Incorporated
(1)
For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2)
"–" indicates the device is not available in this package.
5 Device Comparison Table
MAXIMUM
OPERATING
CURRENT
OUTPUT
DISCHARGE
ENABLE
BASE PART
NUMBER
PACKAGED DEVICE AND MARKING(1)
MSOP-8 (DGN)
PowerPAD™
SOT23-5
(DBV)
VSSOP-8
(DGK)
0.5
Y
Low
TPS2041C
(2)
PYJI
0.5
Y
High
TPS2051C
VBYQ
1
Y
Low
TPS2061C
PXMI
PXLI
1
Y
High
TPS2065C
VCAQ
VCAQ
1
N
High
TPS2065C-2
PYRI
PYQI
1.5
Y
Low
TPS2068C
PXNI
1.5
Y
High
TPS2069C
VBUQ
PYKI
1.5
N
High
TPS2069C-2
PYSI
2
Y
Low
TPS2000C
BCMS
PXFI
2
Y
High
TPS2001C
VBWQ
PXGI
6 Pin Configuration and Functions
DGN Package
8-Pin MSOP-PowerPAD
Top View
DGK Package
8-Pin VSSOP
Top View
Pin Functions - 8 Pins
PIN
I/O
DESCRIPTION
NAME
NO.
EN/EN
4
I
Enable input, logic high turns on power switch
FLT
5
O
Active-low open-drain output, asserted during overcurrent, or overtemperature conditions
GND
1
Ground connection
IN
2, 3
PWR
Input voltage and power-switch drain; connect a 0.1-µF or greater ceramic capacitor from IN to
GND close to the IC
OUT
6, 7, 8
PWR
Power-switch output, connect to load
PowerPAD
(DGN Only)
PowerPAD
Internally connected to GND. Connect PAD to GND plane as a heatsink for the best thermal
performance. PAD may be left floating if desired. See Power Dissipation and Junction
Temperature for guidance.


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