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TPS2505 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS2505 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page TPS2505 SPAS093C – DECEMBER 2009 – REVISED SEPTEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted). (1) (2) MIN MAX UNIT Input voltage on SW, AUX, IN, USB, ENUSB, EN, FAULT, ILIM –0.3 7 V FAULT sink current 25 mA ILIM source current 1 mA Operating junction temperature, TJ –40 125 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Voltages are referenced to GND and PGND tied together. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all ±2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- ±500 C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Supply voltage at IN 1.8 5.25 V VSTART Supply voltage at IN for start-up 2.2 V Enable voltage at EN, ENUSB1, ENUSB2, ENLDO 0 5.25 V TA Operating free air temperature range –40 85 °C TJ Operating junction temperature range –40 125 °C 6.4 Thermal Information TPS2505 THERMAL METRIC(1) RGW (VQFN) UNIT 20 PINS RθJA Junction-to-ambient thermal resistance 34.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 30 °C/W RθJB Junction-to-board thermal resistance 13.5 °C/W ψJT Junction-to-top characterization parameter 0.4 °C/W ψJB Junction-to-board characterization parameter 13.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 3.1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: TPS2505 |
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