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TPS61006 Datasheet(PDF) 4 Page - Texas Instruments

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No. de Pieza. TPS61006
Descripción  Single- and Dual-Cell Boost Converter
Descarga  25 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS61006 Datasheet(HTML) 4 Page - Texas Instruments

 
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TPS61000, TPS61001, TPS61002, TPS61003
TPS61004, TPS61005, TPS61006, TPS61007
SLVS279D – MARCH 2000 – REVISED AUGUST 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Input voltage (VBAT, VOUT, COMP, FB, LBO, EN, LBI)
–0.3
3.6
V
VI
Input voltage (SW)
–0.3
VOUT + 0.7
V
Peak current into SW
1300
mA
Continuous total power dissipation
See Thermal Information
TA
Operating free-air temperature
–40
85
°C
TJ
Maximum junction temperature
150
°C
Lead temperature
260
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VBAT
Supply voltage
0.8
VO
V
VBAT = 0.8 V
100
VO
Output current
mA
VBAT = 0.8 V
250
Inductor
10
33
µH
Input capacitor
10
µF
Output capacitor
22
µF
TJ
Operating junction temperature
–40
125
°C
7.4 Thermal Information
TPS6100x
THERMAL METRIC(1)
DGS (VSSOP)
UNIT
10 PINS
RθJA
Junction-to-ambient thermal resistance
160.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
54.4
°C/W
RθJB
Junction-to-board thermal resistance
80.5
°C/W
ψJT
Junction-to-top characterization parameter
6.3
°C/W
ψJB
Junction-to-board characterization parameter
79.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: TPS61000 TPS61001 TPS61002 TPS61003 TPS61004 TPS61005 TPS61006 TPS61007


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