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ADC1061CIN Datasheet(PDF) 7 Page - National Semiconductor (TI) |
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ADC1061CIN Datasheet(HTML) 7 Page - National Semiconductor (TI) |
7 / 11 page Functional Description (Continued) The remaining four LSBs may now be determined using the same sixteen comparators that were used for the first flash conversion. The MSB Ladder tap voltage just below the input voltage (as determined by the first flash) is subtracted from the input voltage and compared with the tap points on the sixteen LSB Ladder resistors. The result of this second flash conversion is then decoded, and the full 10-bit result is latched. Note that the sixteen comparators used in the first flash con- version are reused for the second flash. Thus, the half-flash conversion techniques used in the ADC1061 needs only a small fraction of the number of comparators that would be re- quired for a traditional flash converter, and far fewer than would be used in a conventional half-flash approach. This al- lows the ADC1061 to perform high-speed conversions with- out excessive power drain. Applications Information 1.0 Modes of Operation The ADC1061 has two basic digital interface modes. These are illustrated in Figure 1 and Figure 2. MODE 1 In this mode, the S /H pin controls the start of conversion. S /H is pulled low for a minimum of 250 ns. This causes the comparators in the “coarse” flash converter to become ac- tive. When S /H goes high, the result of the coarse conver- sion is latched and the “fine” conversion begins. After ap- proximately 1.2 µs (1.8 µs maximum), INT goes low, indicating that the conversion results are latched and can be read by pulling RD low. Note that CS must be low to enable S /H or RD . CS is internally “ANDed” with the sample and read control signals; the input voltage is sampled when CS and S /H are low, and is read when CS and RD are low. MODE 2 In Mode 2, also called “RD mode”, the S /H and RD pins are tied together. A conversion is initiated by pulling both pins low. The ADC1061 samples the input voltage and causes the coarse comparators to become active. An internal timer then terminates the coarse conversion and begins the fine con- version. About 1.8 µs (2.4 µs maximum) after S /H and RD are pulled low, INT goes low, indicating that the conversion is complete. Approximately 20 ns later the data appearing on the TRI-STATE output pins will be valid. Note that data will ap- pear on these pins throughout the conversion, but will be valid only after INT goes low. DS010559-13 FIGURE 3. Block Diagram of the Modified Half-Flash Converter Architecture www.national.com 7 |
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