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AMC1305L25 Datasheet(PDF) 4 Page - Texas Instruments |
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AMC1305L25 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 39 page AMC1305L25, AMC1305M05, AMC1305M25 SBAS654C – JUNE 2014 – REVISED DECEMBER 2014 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings over the operating ambient temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, AVDD to AGND or DVDD to DGND –0.3 6.5 V Analog input voltage at AINP, AINN AGND – 6 AVDD + 0.5 V Digital input voltage at CLKIN, CLKIN_N DGND – 0.3 DVDD + 0.3 V Input current to any pin except supply pins –10 10 mA Maximum virtual junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute- maximum-rated conditions for extended periods may affect device reliability. 8.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- ±1000 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TA Operating ambient temperature range –40 125 °C AVDD High-side (analog) supply voltage 4.5 5.0 5.5 V DVDD Controller-side (digital) supply voltage 3.0 3.3 5.5 V 8.4 Thermal Information AMC1305x THERMAL METRIC(1) DW (SOIC) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 80.2 RθJC(top) Junction-to-case (top) thermal resistance 40.5 RθJB Junction-to-board thermal resistance 45.1 °C/W ψJT Junction-to-top characterization parameter 11.9 ψJB Junction-to-board characterization parameter 44.5 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 8.5 Regulatory Information VDE UL, cUL Recognized under UL1577 component recognition and CSA Certified according to DIN V VDE V 0884-10 component acceptance NO 5 programs File number: 40040142 File number: E181974 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: AMC1305L25 AMC1305M05 AMC1305M25 |
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