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DAC088S085 Datasheet(PDF) 4 Page - Texas Instruments |
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DAC088S085 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 41 page  4 DAC088S085 SNAS424D – AUGUST 2007 – REVISED APRIL 2016 www.ti.com Product Folder Links: DAC088S085 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated (1) WQFN only Pin Functions PIN TYPE DESCRIPTION NAME NO. WQFN TSSOP DIN 15 1 Digital Input Serial Data Input. Data is clocked into the 16-bit shift register on the falling edges of SCLK after the fall of SYNC. DOUT 16 2 Digital Output Serial Data Output. DOUT is used in daisy chain operation and is connected directly to a DIN pin on another DAC088S085. Data is not available at DOUT unless SYNC remains low for more than 16 SCLK cycles. GND 8 10 Ground Ground reference for all on-chip circuitry. SCLK 14 16 Digital Input Serial Clock Input. Data is clocked into the input shift register on the falling edges of this pin. SYNC 13 15 Digital Input Frame Synchronization Input. When this pin goes low, data is written into the DAC's input shift register on the falling edges of SCLK. After the 16th falling edge of SCLK, a rising edge of SYNC causes the DAC to be updated. If SYNC is brought high before the 15th falling edge of SCLK, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the DAC. VA 5 7 Supply Power supply input. Must be decoupled to GND. VOUTA 1 3 Analog Output Channel A Analog Output Voltage. VOUTB 2 4 Analog Output Channel B Analog Output Voltage. VOUTC 3 5 Analog Output Channel C Analog Output Voltage. VOUTD 4 6 Analog Output Channel D Analog Output Voltage. VOUTE 12 14 Analog Output Channel E Analog Output Voltage. VOUTF 11 13 Analog Output Channel F Analog Output Voltage. VOUTG 10 12 Analog Output Channel G Analog Output Voltage. VOUTH 9 11 Analog Output Channel H Analog Output Voltage. VREF1 6 8 Analog Input Unbuffered reference voltage shared by Channels A, B, C, and D. Must be decoupled to GND. VREF2 7 9 Analog Input Unbuffered reference voltage shared by Channels E, F, G, and H. Must be decoupled to GND. PAD(1) — — Ground Exposed die attach pad can be connected to ground or left floating. Soldering the pad to the PCB offers optimal thermal performance and enhances package self-alignment during reflow. |
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