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DAC102S085 Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza DAC102S085
Descripción Electrónicos  DAC102S085 10-Bit Micro Power DUAL Digital-to-Analog Converter With Rail-to-Rail Output
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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DAC102S085
SNAS364F – MAY 2006 – REVISED APRIL 2016
www.ti.com
Product Folder Links: DAC102S085
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(4)
When the input voltage at any pin exceeds 5.5 V or is less than GND, the current at that pin should be limited to 10 mA. The 20-mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of
10 mA to two.
(5)
The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (RθJA), and the ambient
temperature (TA), and can be calculated using the formula PDmax = (TJmax - TA) / RθJA.
7 Specifications
7.1 Absolute Maximum Ratings
See
(1) (2) (3)
MIN
MAX
UNIT
Supply voltage
VA
6.5
V
Voltage
DIN, SCLK, SYNC, VREFIN
−0.3
6.5
V
Input current(4)
10
mA
Package input current(4)
20
mA
Power consumption at TA = 25°C
See(5)
Junction temperature, TJ
150
°C
Storage temperature, Tstg
−65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±250
(1)
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(2)
The inputs are protected. Input voltage magnitudes up to 5.5 V, regardless of VA, do not cause errors in the conversion result. For
example, if VA is 3 V, the digital input pins can be driven with a 5-V logic device.
7.3 Recommended Operating Conditions
See
(1)
MIN
MAX
UNIT
Operating temperature
–40
105
°C
VA
Supply voltage
2.7
5.5
V
VREFIN
Reference voltage
1
VA
V
Digital input voltage(2)
0
5.5
V
Output load
0
1500
pF
SCLK frequency
40
MHz
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1)
DAC102S085
UNIT
DGS (VSSOP)
DSC (WSON)
10 PINS
10 PINS
RθJA
Junction-to-ambient thermal resistance
240
250
°C/W


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