AD9726

Rev. A | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

With Respect to

Rating

DBVDD, AVDD1, AVDD2

DBGND, AGND1,

AGND2

–0.3 V to 3.6 V

DVDD, CLKVDD,

ACVDD, ADVDD

DGND, CLKGND,

ACGND, ADGND

–0.3 V to 2.8 V

DBGND, AGND1,

AGND2

DBGND, AGND1,

AGND2

–0.3 V to +0.3 V

DGND, CLKGND,

ACGND, ADGND

DGND, CLKGND,

ACGND, ADGND

–0.3 V to +0.3 V

REFIO, FSDAJ

AGND1

–0.3 V to AVDD1

+ 0.3 V

IOUTA, IOUTB

AGND1

–1.0 V to AVDD1

+ 0.3 V

CLK+, CLK–

CLKGND

–0.3 V to

CLKVDD + 0.3 V

DB[15:0]+/–,

DCLK_IN+/–,

DCLK_OUT+/–

DBGND

−0.3 V to

DBVDD + 0.3 V

CSB, SCLK, SDIO,

SDO, RESET, REXT

DBGND

–0.3 V to DBVDD

+ 0.3 V

SDR_EN, SPI_DIS

ADGND

–0.3 V to

ADVDD + 0.3 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Thermal impedance can be lowered to 23°C/W by soldering the

exposed package pad to an external heat sink (for example, the

internal PCB copper ground plane). However, this is not necessary

for the power dissipation and operating temperature range of

the AD9726.

Table 6. Thermal Resistance

Package Type

Unit

80-Lead TQFP_EP Package, Thermally Enhanced

32

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-

tion or loss of functionality.