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DMP3035SFG-13 Datasheet(Hoja de datos) 3 Page - Diodes Incorporated

No. de Pieza. DMP3035SFG-13
Descripción  30V P-CHANNEL ENHANCEMENT MODE MOSFET
Descarga  7 Pages
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Fabricante  DIODES [Diodes Incorporated]
Página de inicio  http://www.diodes.com
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POWERDI is a registered trademark of Diodes Incorporated
DMP3035SFG
Document number: DS35440 Rev. 3 - 2
3 of 7
www.diodes.com
May 2012
© Diodes Incorporated
DMP3035SFG
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Fig. 3 Transient Thermal Resistance
0.001
0.01
0.1
1
R
(t) = r(t) * R
θθ
JA
JA
R
= 54°C/W
Duty Cycle, D = t1/ t2
θJA
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
Electrical Characteristics TA = 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
-30
-
-
V
VGS = 0V, ID = -250μA
Zero Gate Voltage Drain Current
IDSS
-
-
-1.0
μA
VDS = -30V, VGS = 0V
Gate-Source Leakage
IGSS
-
-
±100
nA
VGS = ±25V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(th)
-1.0
-1.7
-2.5
V
VDS = VGS, ID = -250μA
Static Drain-Source On-Resistance
RDS (ON)
-
15
20
m
VGS = -10V, ID = -8A
-
21
29
VGS = -5V, ID = -5A
Forward Transfer Admittance
|Yfs|
-
22
-
S
VDS = -5V, ID = -10.0A
Diode Forward Voltage
VSD
-
-0.74
-1.0
V
VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
-
1633
-
pF
VDS = -15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
Coss
-
459
-
pF
Reverse Transfer Capacitance
Crss
-
214
-
pF
Gate Resistance
Rg
-
6.5
13
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge VGS = -4.5V
Qg
-
17
-
nC
VDS = -15V, VGS = -10V, ID = 8A
Total Gate Charge VGS = -10V
Qg
-
35.5
-
nC
Gate-Source Charge
Qgs
-
4.6
-
nC
Gate-Drain Charge
Qgd
-
5.7
-
nC
Turn-On Delay Time
tD(on)
-
8.5
-
ns
VGEN = -10V, VDD = -15V,
RGEN = 3Ω, ID = -15A
Turn-On Rise Time
tr
-
14
-
ns
Turn-Off Delay Time
tD(off)
-
50
-
ns
Turn-Off Fall Time
tf
-
25.8
-
ns
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.




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