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FDC1004 Datasheet(PDF) 5 Page - Texas Instruments

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No. de pieza FDC1004
Descripción Electrónicos  4-Channel Capacitance-to-Digital Converter
Download  33 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

FDC1004 Datasheet(HTML) 5 Page - Texas Instruments

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FDC1004
www.ti.com
SNOSCY5B – AUGUST 2014 – REVISED APRIL 2015
7 Specifications
7.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Input voltage
VDD
–0.3
6
V
SCL, SDA
–0.3
6
V
at any other pin
–0.3
VDD+0.3
V
Input current
at any pin
3
mA
Junction temperature(2)
150
°C
Storage temperature
TSTG
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC
board.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC
±1000
JS-001, all pins(2)
V(ESD)
Electrostatic discharge(1)
V
Charged device model (CDM), per JEDEC
±250
specification -500 500 JESD22-C101, all pins(3)
(1)
Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
(2)
Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
(3)
Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
Over operating temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage (VDD-GND)
3
3.3
3.6
V
Temperature
–40
125
°C
7.4 Thermal Information
FDC1004
THERMAL METRIC(1)
WSON (DSC)
VSSOP (DGS)
UNIT
10 PINS
RθJA
Junction-to-ambient thermal resistance
46.8
46.8
°C/W
RθJC
Junction-to-case(top) thermal resistance
46.7
48.7
°C/W
RθJB
Junction-to-board thermal resistance
21.5
70.6
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2014–2015, Texas Instruments Incorporated
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