FDC1004Q

SNOSCZ4 – APRIL 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Input voltage

VDD

–0.3

6

V

SCL, SDA

–0.3

6

V

at any other pin

–0.3

VDD+0.3

V

Input current

at any pin

3

mA

150

°C

Storage Temperature

-65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

board.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

Over operating temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage (VDD-GND)

3

3.3

3.6

V

Temperature

–40

125

°C

7.4 Thermal Information

FDC1004Q

VSSOP (DGS)

UNIT

10 PINS

Junction-to-ambient thermal resistance

46.8

°C/W

Junction-to-case(top) thermal resistance

48.7

°C/W

Junction-to-board thermal resistance

70.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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