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LM340K-5.0 Datasheet(PDF) 4 Page - Texas Instruments |
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LM340K-5.0 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 LM340, LM340A, LM7805, LM7812, LM7815 SNOSBT0K – FEBRUARY 2000 – REVISED JULY 2016 www.ti.com Product Folder Links: LM340 LM340A LM7805 LM7812 LM7815 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX − TA)/θJA. If this dissipation is exceeded, the die temperature rises above TJMAX and the electrical specifications do not apply. If the die temperature rises above 150°C, the device goes into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal resistance (θJA) is 39°C/W. When using a heat sink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3 package and the case-to-ambient thermal resistance of the heat sink. For the TO-220 package (NDE), θJA is 54°C/W and θJC is 4°C/W. If SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heat sink (see Applications Hints on heat sinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PCB copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more inches of copper area, θJA is 32°C/W. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT DC input voltage 35 V Internal power dissipation(3) Internally Limited Maximum junction temperature 150 °C Lead temperature (soldering, 10 sec.) TO-3 package (NDS) 300 °C Lead temperature 1,6 mm (1/16 in) from case for 10 s 230 °C Storage temperature −65 150 °C (1) ESD rating is based on the human-body model, 100 pF discharged through 1.5 kΩ. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM)(1) ±2000 V 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Temperature (TA) LM340A, LM340 0 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LM340, LM78xx UNIT NDE (TO-220) KTT (DDPAK/TO-263) DCY (SOT-223) NDS (TO-3) 3 PINS 3 PINS 4 PINS 2 PINS RθJA Junction-to-ambient thermal resistance 23.9 44.8 62.1 39 °C/W RθJC(top) Junction-to-case (top) thermal resistance 16.7 45.6 44 2 °C/W RθJB Junction-to-board thermal resistance 5.3 24.4 10.7 — °C/W ψJT Junction-to-top characterization parameter 3.2 11.2 2.7 — °C/W ψJB Junction-to-board characterization parameter 5.3 23.4 10.6 — °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 1.5 — — °C/W |
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