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LM4132BMFX-2.0/NOPB Datasheet(PDF) 3 Page - Texas Instruments |
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LM4132BMFX-2.0/NOPB Datasheet(HTML) 3 Page - Texas Instruments |
3 / 40 page VIN 1 2 3 5 4 EN GND N/C VREF 3 LM4132, LM4132-Q1 www.ti.com SNVS372F – AUGUST 2005 – REVISED MARCH 2016 Product Folder Links: LM4132 LM4132-Q1 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated (1) G: Ground; I: Input; P: Power 5 Pin Configuration and Functions DBV Package 5-Pin SOT-23 Top View Pin Functions PIN I/O(1) DESCRIPTION NO. NAME 1 N/C — No connect pin, leave floating 2 GND G Ground 3 EN I Enable pin 4 VIN P Input supply 5 VREF P Reference output (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Without PCB copper enhancements. The maximum power dissipation must be de-rated at elevated temperatures and is limited by TJMAX (maximum junction temperature), RθJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum power dissipation at any temperature is: PDissMAX = (TJMAX – TA) / RθJA up to the value listed in theAbsolute Maximum Ratings. RθJA for SOT- 23 is 164.1°C/W, TJMAX = 125°C. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Voltage Maximum voltage on any input –0.3 6 V Output short circuit duration Indefinite Power dissipation (TA = 25°C) (3) 350 mW Lead temperature (soldering, 10 sec) 260 °C Vapor phase (60 sec) 215 °C Infrared (15 sec) 220 °C Storage temperature, Tstg −65 150 °C |
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