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LM4132DMF-4.1/NOPB Datasheet(PDF) 3 Page - Texas Instruments

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No. de pieza LM4132DMF-4.1/NOPB
Descripción Electrónicos  LM4132, LM4132-Q1 SOT-23 Precision Low Dropout Voltage Reference
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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LM4132DMF-4.1/NOPB Datasheet(HTML) 3 Page - Texas Instruments

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VIN
1
2
3
5
4
EN
GND
N/C
VREF
3
LM4132, LM4132-Q1
www.ti.com
SNVS372F – AUGUST 2005 – REVISED MARCH 2016
Product Folder Links: LM4132 LM4132-Q1
Submit Documentation Feedback
Copyright © 2005–2016, Texas Instruments Incorporated
(1)
G: Ground; I: Input; P: Power
5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
Pin Functions
PIN
I/O(1)
DESCRIPTION
NO.
NAME
1
N/C
No connect pin, leave floating
2
GND
G
Ground
3
EN
I
Enable pin
4
VIN
P
Input supply
5
VREF
P
Reference output
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
Without PCB copper enhancements. The maximum power dissipation must be de-rated at elevated temperatures and is limited by TJMAX
(maximum junction temperature), RθJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum power
dissipation at any temperature is: PDissMAX = (TJMAX – TA) / RθJA up to the value listed in theAbsolute Maximum Ratings. RθJA for SOT-
23 is 164.1°C/W, TJMAX = 125°C.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Voltage
Maximum voltage on any input
–0.3
6
V
Output short circuit duration
Indefinite
Power dissipation (TA = 25°C)
(3)
350
mW
Lead temperature (soldering, 10 sec)
260
°C
Vapor phase (60 sec)
215
°C
Infrared (15 sec)
220
°C
Storage temperature, Tstg
−65
150
°C


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