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TPS72516DCQ Datasheet(PDF) 11 Page - Texas Instruments |
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TPS72516DCQ Datasheet(HTML) 11 Page - Texas Instruments |
11 / 18 page www.ti.com A B C TJ A RθJC TC B RθCS TA C RθSA (a) (b) DDPAK Package SOT223 Package CIRCUIT BOARD COPPER AREA B A C T J + T A ) P Dmax x R θJC ) RθCS ) RθSA (4) T J + T A ) P Dmax x R θJA (5) RθJA + T J–TA P Dmax (6) DDPAK Power Dissipation TPS72501 TPS72515, TPS72516 TPS72518, TPS72525 SLVS341D – MAY 2002 – REVISED MARCH 2004 THERMAL INFORMATION (continued) Figure 20. Thermal Resistances Equation 4 summarizes the computation: The RθJC is specific to each regulator as determined by its package, lead frame, and die size provided in the regulator's data sheet. The RθSA is a function of the type and size of heatsink. For example, black body radiator type heatsinks can have RθCS values ranging from 5°C/W for very large heatsinks to 50°C/W for very small heatsinks. The RθCS is a function of how the package is attached to the heatsink. For example, if a thermal compound is used to attach a heatsink to a SOT223 package, RθCSof 1°C/W is reasonable. Even if no external black body radiator type heatsink is attached to the package, the board on which the regulator is mounted provides some heatsinking through the pin solder connections. Some packages, like the DDPAK and SOT223 packages, use a copper plane underneath the package or the circuit board's ground plane for additional heatsinking to improve their thermal performance. Computer-aided thermal modeling can be used to compute very accurate approximations of an integrated circuit's thermal performance in different operating environments (e.g., different types of circuit boards, different types and sizes of heatsinks, different air flows, etc.). Using these models, the three thermal resistances can be combined into one thermal resistance between junction and ambient (RθJA). This RθJAis valid only for the specific operating environment used in the computer model. Equation 4 simplifies into Equation 5: Rearranging Equation 5 gives Equation 6: Using Equation 5 and the computer model generated curves shown in Figure 21 and Figure 24, a designer can quickly compute the required heatsink thermal resistance/board area for a given ambient temperature, power dissipation, and operating environment. The DDPAK package provides an effective means of managing power dissipation in surface mount applications. The DDPAK package dimensions are provided in the Mechanical Data section at the end of the data sheet. The addition of a copper plane directly underneath the DDPAK package enhances the thermal performance of the package. 11 |
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