GND

LM57-Q1

www.ti.com

SNIS191A – JULY 2015 – REVISED JULY 2015

Pin Functions (continued)

PIN

TYPE

EQUIVALENT CIRCUIT

DESCRIPTION

NAME

NO.

Analog

8

Output

This pin may be left open if not used.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage

−0.3

6

V

−0.3

6

V

−0.3

V

Current at any pin

5

mA

Storage temperature for LM57FSPWQ1 and LM57TSPWQ1

−65

175

°C

Storage temperature for all LM57-Q1 except LM57FSPWQ1 and LM57TSPWQ1

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

FOR ALL PARTS GRADE 0 AND GRADE 1 EXCEPT GRADE 0 EXTENDED (LM57FSPWQ1 and LM57TSPWQ1)

Supply voltage

2.4

5.5

V

−50

150

°C

LM57FQPWQ1, LM57TQPWQ1

-50

125

°C

GRADE 0 EXTENDED (LM57FSPWQ1 AND LM57TSPWQ1)

Supply voltage

2.4

5.5

V

Extended High Temperature Operational Life Test

−50

170

°C

(1)

Except for HTOL testing, which was conducted as described, all other testing was to AEC-Q100 Grade 0 flow. Full details on reliability

testing are available upon request.

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