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LMP2234 Datasheet(PDF) 2 Page - Texas Instruments |
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LMP2234 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page ADC121S021 IN V + LM4140A 6 2 1,4,7,8 3 V + 1 PF + - 10 PF V + 0.1 PF + - + - - + 12 k: 10 k: 40 k: ¼ LMP2234 R+'R R+'R R R V + V + V + 12 k: 10 k: 40 k: 1 k: VA GND ¼ LMP2234 ¼ LMP2234 ¼ LMP2234 LMP2234 SNOSAW4D – SEPTEMBER 2007 – REVISED MARCH 2013 www.ti.com TYPICAL APPLICATION Figure 1. Strain Gauge Bridge Amplifier These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) ESD Tolerance(3) Human Body Model 2000V Machine Model 100V Differential Input Voltage ±300 mV Supply Voltage (VS = V + - V–) 6V Voltage on Input/Output Pins V+ + 0.3V, V– – 0.3V Storage Temperature Range −65°C to 150°C Junction Temperature(4) 150°C Mounting Temperature Infrared or Convection (20 sec.) +235°C Wave Soldering Lead Temperature (10 sec.) +260°C (1) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (4) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMP2234 |
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