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LM2901QDRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2901QDRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 20 page 4 LM2901-Q1, LM2901V-Q1, LM2901AV-Q1 SLCS142E – DECEMBER 2003 – REVISED MAY 2016 www.ti.com Product Folder Links: LM2901-Q1 LM2901V-Q1 LM2901AV-Q1 Submit Documentation Feedback Copyright © 2003–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground. (3) Differential voltages are at IN+ with respect to IN −. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VCC (2) 36 V Differential input voltage, VID (3) ±36 Input voltage range, VI (either input) –0.3 36 Output voltage, VO 36 Output current, IO 20 mA Duration of output short circuit to ground(4) Unlimited Lead temperature 1,6 mm (1/16 inch) from case for 10 s 260 °C Operating virtual junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage LM2901-Q1 2 30 V LM2901V-Q1, LM2901AV-Q1 2 32 TA Ambient temperature –40 125 °C IO Output current (per comparator) 0 4 mA (1) For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics application report, SPRA953. (2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 6.4 Thermal Information THERMAL METRIC(1) LM2901x-Q1 UNIT D (SOIC) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance(2) 88.6 119.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 49.1 47.9 °C/W RθJB Junction-to-board thermal resistance 43.0 60.9 °C/W ψJT Junction-to-top characterization parameter 13.6 5.4 °C/W ψJB Junction-to-board characterization parameter 42.7 60.3 °C/W |
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