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TMP816 Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza TMP816
Descripción Electrónicos  TMP816 Variable-Speed Single-Phase Full-Wave Fan-Motor Predriver
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TMP816 Datasheet(HTML) 4 Page - Texas Instruments

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TMP816
SLVS787A – MAY 2009 – REVISED JUNE 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
18
V
VOUT Output voltage
OUT1P, OUT1N, OUT2P, OUT2N
18
Continuous output
IOUT
OUT1P, OUT1N, OUT2P, OUT2N
50
current
Continuous output
mA
IHB
HB
10
current
VTH
Input voltage
VTH
8
VRD
Output voltage
RD, FG
18
V
VFG
IRD
Continuous output
RD, FG
10
mA
IFG
current
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101, all
±1000
pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
TA = 25°C
MIN
MAX
UNIT
VCC
Supply voltage
6
16
V
VTH
VTH input voltage
Full-speed mode
0
7
V
VICM
Hall input common phase input voltage
0.2
3
V
TA
Operating free-air temperature
–30
95
°C
6.4 Thermal Information
TMP816
THERMAL METRIC(1)
PW (TSSOP)
UNIT
20 PINS
RθJA
Junction-to-ambient thermal resistance
83
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
90.6
°C/W
RθJB
Junction-to-board thermal resistance
42.1
°C/W
ψJT
Junction-to-top characterization parameter
24.3
°C/W
ψJB
Junction-to-board characterization parameter
0.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
51.5
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Product Folder Links: TMP816


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