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TMP816 Datasheet(PDF) 4 Page - Texas Instruments |
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TMP816 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 20 page TMP816 SLVS787A – MAY 2009 – REVISED JUNE 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage 18 V VOUT Output voltage OUT1P, OUT1N, OUT2P, OUT2N 18 Continuous output IOUT OUT1P, OUT1N, OUT2P, OUT2N 50 current Continuous output mA IHB HB 10 current VTH Input voltage VTH 8 VRD Output voltage RD, FG 18 V VFG IRD Continuous output RD, FG 10 mA IFG current Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2500 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, all ±1000 pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions TA = 25°C MIN MAX UNIT VCC Supply voltage 6 16 V VTH VTH input voltage Full-speed mode 0 7 V VICM Hall input common phase input voltage 0.2 3 V TA Operating free-air temperature –30 95 °C 6.4 Thermal Information TMP816 THERMAL METRIC(1) PW (TSSOP) UNIT 20 PINS RθJA Junction-to-ambient thermal resistance 83 °C/W RθJC(top) Junction-to-case (top) thermal resistance 90.6 °C/W RθJB Junction-to-board thermal resistance 42.1 °C/W ψJT Junction-to-top characterization parameter 24.3 °C/W ψJB Junction-to-board characterization parameter 0.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 51.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: TMP816 |
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