TPS22914B, TPS22914C, TPS22915B, TPS22915C

SLVSCO0C – JUNE 2014 – REVISED JULY 2015

www.ti.com

8 Specifications

8.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input voltage range

–0.3

6

V

Output voltage range

–0.3

6

V

ON voltage range

–0.3

6

V

Maximum continuous switch current

2

A

Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle

2.5

A

Maximum junction temperature

125

°C

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

8.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

8.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage range

1.05

5.5

V

ON voltage range

0

5.5

V

Output voltage range

V

High-level input voltage, ON

1

5.5

V

Low-level input voltage, ON

0

0.5

V

–40

105

°C

Input Capacitor

µF

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

in the application (

(2)

Refer to Detailed Description section

8.4 Thermal Information

TPS2291x

YFP (DSBGA)

UNIT

4 PINS

Junction-to-ambient thermal resistance

193

°C/W

Junction-to-case (top) thermal resistance

2.3

°C/W

Junction-to-board thermal resistance

36

°C/W

Junction-to-top characterization parameter

12

°C/W

Junction-to-board characterization parameter

36

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2014–2015, Texas Instruments Incorporated

Product Folder Links: TPS22914B TPS22914C TPS22915B TPS22915C