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TPS22961 Datasheet(PDF) 1 Page - Texas Instruments

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No. de pieza TPS22961
Descripción Electrónicos  3.5-V, 6-A, Ultra-low Resistance Load Switch
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TPS22961 Datasheet(HTML) 1 Page - Texas Instruments

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IN (V)
-40
SC
25
SC
85
SC
C007
Power
Supply
OFF
ON
TPS22961
VIN
VOUT
C
L
ON
C
IN
VBIAS
(4.5V to 5.5V)
GND
Processor
(x86, FPGA,
DSP)
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TPS22961
SLVSCI4B – FEBRUARY 2014 – REVISED SEPTEMBER 2014
TPS22961 3.5-V, 6-A, Ultra-low Resistance Load Switch
1 Features
3 Description
The TPS22961 is a small, ultra-low RON, single
1
Integrated Single Channel Load Switch
channel load switch with controlled turn on. The
VBIAS Voltage Range: 3 V to 5.5 V
device contains an N-channel MOSFET that can
Input Voltage Range: 0.8 V to 3.5 V
operate over an input voltage range of 0.8 V to 3.5 V
and supports a maximum continuous current of 6 A.
Ultra low RON Resistance
RON = 4.4 mΩ at VIN = 1.05 V (VBIAS = 5 V)
The combination of ultra-low RON and high current
capability of the device makes it ideal for driving
6A Maximum Continuous Switch Current
processor
rails
with
very
tight
voltage
dropout
Low Quiescent Current < 1 µA (max)
tolerances. Quick rise time of the device allows for
Low Control Input Threshold Enables use of 1.2-
power rails to come up quickly when the device is
V/1.8-V/2.5-V/3.3-V Logic
enabled, thereby reducing response time for power
distribution.
The
switch
can
be
independently
Controlled Slew Rate
controlled via the ON terminal, which is capable of
tR = 4.2 µs at VIN = 1.05 V (VBIAS = 5 V)
interfacing directly with low-voltage control signals
Quick Output Discharge (QOD)
originating
from
microcontrollers
or
low
voltage
discrete logic. The device further reduces the total
SON 8-terminal Package with Thermal Pad
solution size by integrating a 260
Ω pull-down
ESD Performance Tested per JESD 22
transistor for quick output discharge (QOD) when the
2-kV HBM and 1-kV CDM
switch is turned off.
The TPS22961 is available in a small, space-saving 3
2 Applications
mm x 3 mm 8-SON package (DNY) with integrated
Ultrabook™/Notebooks
thermal pad allowing for high power dissipation. The
device is characterized for operation over the free-air
Desktops
temperature range of –40°C to 85°C.
Servers
Set-top Boxes
Device Information(1)
Telecom Systems
PART NUMBER
PACKAGE
BODY SIZE
Tablet PC
TPS22961
WSON (8)
3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
RON vs VIN (VBIAS = 5 V, IOUT = –200 mA)
Typical Application: driving high current
core rails for a processor
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


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