TPS22994

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SLVSCL4B – AUGUST 2014 – REVISED SEPTEMBER 2014

8 Specifications

8.1 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

1.0

Input voltage for VIN1, VIN2, VIN3,

V

VIN4

1.0

3.6

Supply voltage for VBIAS

2.7

17.2

V

Supply voltage for VDD

1.62

3.6

V

Input voltage for ADD1, ADD2, ADD3

0

V

Input voltage for ON1, ON2, ON3, ON4

0

5

V

Output voltage for VOUT1, VOUT2, VOUT3, VOUT4

0

V

Input capacitor on VIN1, VIN2, VIN3, VIN4

µF

(1)

Refer to application section.

8.2 Absolute Maximum Ratings

(1)

Over operating free-air temperature range (unless otherwise noted)

VALUE

MIN

MAX

Input voltage for VIN1, VIN2, VIN3, VIN4

–0.3

4

V

Supply voltage for VBIAS

–0.3

20

V

Output voltage for VOUT1, VOUT2, VOUT3, VOUT4

–0.3

4

V

Input voltage for VDD, SCL, SDA, ADD1, ADD2, ADD3

–0.3

4

V

Input voltage for ON1, ON2, ON3, ON4

–0.3

6

V

Maximum continuous switch current per channel

1

A

–40

85

°C

Maximum junction temperature

125

°C

Maximum lead temperature (10-s soldering time)

300

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the

8.3 Handling Ratings

MIN

MAX

UNIT

Storage temperature

–65

150

°C

–2000

2000

V

Electrostatic discharge protection

–-500

500

V

(1)

Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in

to the device.

(2)

Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe

manufacturing with a standard ESD control process.

(3)

Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250V CDM allows safe

manufacturing with a standard ESD control process.

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