5

TPS22975

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SLVSDD0A – MAY 2016 – REVISED JUNE 2016

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TPS22975

UNIT

DSG (WSON)

8 PINS

Junction-to-ambient thermal resistance

74.8

°C/W

Junction-to-case (top) thermal resistance

81

°C/W

Junction-to-board thermal resistance

44.7

°C/W

Junction-to-top characterization parameter

3.9

°C/W

Junction-to-board characterization parameter

45.1

°C/W

Junction-to-case (bottom) thermal resistance

16.4

°C/W

(1)

TPS22975 only

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLIES AND CURRENTS

–40°C to +105°C

37

45

µA

–40°C to +105°C

2.3

µA

–40°C to +85°C

0.005

5

µA

–40°C to +105°C

10

–40°C to +85°C

0.002

1.5

–40°C to +105°C

3.5

–40°C to +85°C

0.002

1

–40°C to +105°C

2

–40°C to +85°C

0.001

0.5

–40°C to +105°C

1

On-pin input leakage current

–40°C to +105°C

0.1

µA

RESISTANCE CHARACTERISTICS

On-resistance

25°C

16

19

m

Ω

–40°C to +85°C

23

–40°C to +105°C

25

25°C

16

19

–40°C to +85°C

23

–40°C to +105°C

25

25°C

16

19

–40°C to +85°C

23

–40°C to +105°C

25

25°C

16

19

–40°C to +85°C

23

–40°C to +105°C

25

25°C

16

19

–40°C to +85°C

23

–40°C to +105°C

25

25°C

16

19

–40°C to +85°C

23

–40°C to +105°C

25

On-pin hysteresis

25°C

120

mV

(1)

Output pulldown resistance

–40°C to +105°C

230

300

Ω

Thermal shutdown

Junction temperature rising

160

°C

Thermal shutdown hysteresis

Junction temperature falling

20

°C