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TPS3839G18DQNT Datasheet(PDF) 6 Page - Texas Instruments |
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TPS3839G18DQNT Datasheet(HTML) 6 Page - Texas Instruments |
6 / 31 page TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range, unless otherwise noted (1) MIN MAX UNIT VDD, RESET –0.3 7 V Voltage MR –0.3 VDD + 0.3 V Current RESET pin –10 10 mA Operating ambient, TA –40 85 Temperature(2) °C Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Input supply voltage 0.9 6.5 V VMR Manual reset pin voltage 0 VDD V VRESET RESET pin voltage 0 6.5 V IRESET RESET pin current 0 8 mA 7.4 Thermal Information TPS3831, TPS3839 TPS3839 THERMAL METRIC(1) UNIT DBZ (SOT23-3) DQN (X2SON) 3 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 346.6 216.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 124.4 161.7 °C/W RθJB Junction-to-board thermal resistance 78.9 162.1 °C/W ψJT Junction-to-top characterization parameter 11.5 5.1 °C/W ψJB Junction-to-board characterization parameter 77.3 161.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 123.0 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated |
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