TPS7A4501M

SLVSBG4 – DECEMBER 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE

TOP-SIDE

PACKAGE

PART NUMBER

MARKING

TPS7A4501MUB

1222401QHA

GDFP (U)

5962-1222401QHA

7A4501MU

–55°C to 125°C

TPS7A4501MKGD1

KGD

N/A

5962-1222401Q9A

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

BARE DIE INFORMATION

BACKSIDE

BOND PAD

BOND PAD

DIE THICKNESS

BACKSIDE FINISH

POTENTIAL

METALLIZATION COMPOSITION

THICKNESS

15 mils.

Silicon with backgrind

Floating

TiW/AlCu2

1627 nm

2

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