TPS62623YFDT datasheet(4/28 Pages) TI1

No. de pieza	TPS62623YFDT

Descripción Electrónicos	600-mA, 6-MHz High-Efficiency Step-Down Converter In Chip Scale Packaging

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Fabricante Electrónico	TI1 [Texas Instruments]

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TPS62620, TPS62621, TPS62622

TPS62623, TPS62624, TPS62625

SLVS848D – JULY 2009 – REVISED OCTOBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage at VIN, SW(2)

–0.3

7

VIN

Voltage at FB(2)

-0.3

3.6

V

Voltage at EN, MODE (2)

-0.3

VIN + 0.3

Power dissipation

Internally limited

TA

Operating temperature range(3)

-40

85

°C

TJ (max)

Maximum operating junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max) = TJ(max) – (θJA x PD(max)). To achieve optimum performance, it is

recommended to operate the device with a maximum junction temperature of 105°C.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

±2000

pins(1)

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

±1000

JESD22-C101, all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body

model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

Supply voltage, VIN

2.3

5.5

V

Operating free air temperature, TA

–40

85

°C

Operating junction temperature, TJ

150

°C

7.4 Thermal Information

TPS626x

THERMAL METRIC(1)

YFF/YFD (DSBGA)

UNIT

6 PINS

RθJA

Junction-to-ambient thermal resistance

130

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1.2

°C/W

RθJB

Junction-to-board thermal resistance

22

°C/W

ψJT

Junction-to-top characterization parameter

5.0

°C/W

ψJB

Junction-to-board characterization parameter

22.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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