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TPS61235P, TPS61236P

SLVSCK4A – SEPTEMBER 2015 – REVISED MAY 2016

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Product Folder Links: TPS61235P TPS61236P

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Copyright © 2015–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, EN, VOUT, CC, INACT, FB

–0.3

6

V

SW

–0.3

7

V

–40

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

The maximum input voltage should be 0.6-V lower than the output voltage in Constant Voltage operation for the TPS6123x to function

correctly.

(2)

Effective capacitance value. Ceramic capacitor’s derating effect under bias should be considered when selecting capacitors.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

(1)

Supply voltage at VIN pin

2.3

V

Target output voltage (TPS61235P)

5.1

V

Target output voltage (TPS61236P)

2.9

5.5

V

L

Effective inductance

0.7

1

1.3

µH

4.7

10

µF

20

µF

Capacitor parallel with the RCC resistor connected at CC pin

1

10

nF

INACT pin pull up resistance

1

MΩ

EN pin pull down resistance

1

MΩ

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TPS61235P

UNIT

TPS61236P

RWL (VQFN)

9 PINS

Junction-to-ambient thermal resistance

28.7

°C/W

Junction-to-case(top) thermal resistance

24.1

°C/W

Junction-to-board thermal resistance

10.9

°C/W

Junction-to-top characterization parameter

0.1

°C/W

Junction-to-board characterization parameter

10.8

°C/W

Junction-to-case(bottom) thermal resistance

1.6

°C/W