TPS61291

SLVSBX9A – SEPTEMBER 2014 – REVISED SEPTEMBER 2014

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

-0.3

5.5

SW

-0.3

7

V

EN/BYP, VOUT

-0.3

5.5

VSEL

-0.3

VOUT +

0.3V

Output Current

In Bypass Operation (EN/BYP = GND)

250

mA

Maximum Junction Temperature

-40

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal GND.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM) per ANSI/ESDA/JEDEC

-2

2

Electrostatic discharge

kV

Charged device model (CDM), per JEDEC

-0.5

0.5

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage for startup

1.5

Supply voltage range (once device has started)

0.9

5

V

Supply voltage range for step up conversion (once device has started)

0.9

Operating ambient temperature

-40

85

°C

Operating junction temperature

–40

125

6.4 Thermal Information

TPS61291

DRV (2x2 SON)

UNIT

6 PINS

Junction-to-ambient thermal resistance

71.2

Junction-to-case (top) thermal resistance

93.5

Junction-to-board thermal resistance

46.7

°C/W

Junction-to-top characterization parameter

2.5

Junction-to-board characterization parameter

41.1

Junction-to-case (bottom) thermal resistance

11.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2014, Texas Instruments Incorporated

Product Folder Links: TPS61291