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TPS61300YFFR Datasheet(PDF) 5 Page - Texas Instruments

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No. de Pieza. TPS61300YFFR
Descripción  TPS6130xx 1.5-A and 4.1-A Multiple LED Camera Flash Driver With I2C Compatible Interface
Descarga  70 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS61300YFFR Datasheet(HTML) 5 Page - Texas Instruments

 
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TPS61300, TPS61301
TPS61305, TPS61305A, TPS61306
www.ti.com
SLVS957E – JUNE 2009 – REVISED APRIL 2016
Product Folder Links: TPS61300 TPS61301 TPS61305
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
In applications where high power dissipation or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(MAX)] is dependent on the maximum operating junction temperature [TJ(MAX)], the
maximum power dissipation of the device in the application [PD(MAX)], and the junction-to-ambient thermal resistance of the part and
package in the application (
θJA), as given by the following equation: TA(MAX) = TJ(MAX) – (θJA × PD(MAX))
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Voltage range(2)
AVIN, VOUT, SW, LED1, LED2, LED3, SCL, SDA, FLASH_SYNC, ENDCL,
NRESET, ENVM, GPIO/PG, HC_SEL, Tx-MASK, TS, BAL
–0.3
7
V
Current on GPIO/PG
±25
mA
Power dissipation
Internally limited
Operating ambient temperature(3), TA
–40
85
°C
Maxium operating junction temperature, TJ(MAX)
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
TJ
Operating junction temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1)
TPS6130xx
UNIT
YFF (DSBGA)
20 PINS
RθJA
Junction-to-ambient thermal resistance
70.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
0.4
°C/W
RθJB
Junction-to-board thermal resistance
11.4
°C/W
ψJT
Junction-to-top characterization parameter
1.9
°C/W
ψJB
Junction-to-board characterization parameter
11.2
°C/W


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