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TPS61300YFFR Datasheet(PDF) 63 Page - Texas Instruments

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No. de Pieza. TPS61300YFFR
Descripción  TPS6130xx 1.5-A and 4.1-A Multiple LED Camera Flash Driver With I2C Compatible Interface
Descarga  70 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS61300YFFR Datasheet(HTML) 63 Page - Texas Instruments

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100 120 140 160 180 200
PulseWidth-ms
T =65°Crise
J
T =40°Crise
J
No Airflow
GND
LED1
LED2
LED3
V
IN
L1
C
OUT
C
IN
1
INDLED
SDA
FLASH_SYNC
ENVM (TPS61300/1)
TS
(TPS61305)
B2: SCL
B3: HC_SEL
C3: Tx_MASK
D3: ENDCL (TPS61300)
D4: GPIO/PG
nRESET (TPS61301/5)
BAL
Copyright © 2016, Texas Instruments Incorporated
63
TPS61300, TPS61301
TPS61305, TPS61305A, TPS61306
www.ti.com
SLVS957E – JUNE 2009 – REVISED APRIL 2016
Product Folder Links: TPS61300 TPS61301 TPS61305
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
11.2 Layout Example
Figure 108. Suggested Layout (Top)
11.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where
high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design.
The maximum junction temperature (TJ) of the TPS6130xx is 150°C.
The maximum power dissipation is especially critical when the device operates in the linear down mode at high
LED current. For single pulse power thermal analysis (for example, flashlight strobe), the allowable power
dissipation for the device is given by Figure 109. These values are derived using the reference design.
Figure 109. Single Pulse Power Capability


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