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SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015

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7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

6

V

–0.3

V

Peak switch current

1.6

A

Operating junction temperature

–40

150

°C

Lead temperature (soldering, 10 sec)

260

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2

5.5

V

Output voltage range for adjustable output voltage version

0.8

V

600

mA

200

mA

L

10

μH

10

μF

10

μF

47

μF

Operating ambient temperature

–40

85

°C

Operating junction temperature

–40

125

°C

(1)

Refer to Application Information section for further information.

7.4 Thermal Information

TPS6200x

DGS [VSSOP]

UNIT

10 PINS

Junction-to-ambient thermal resistance

160

°C/W

Junction-to-case (top) thermal resistance

51

°C/W

Junction-to-board thermal resistance

73

°C/W

Junction-to-top characterization parameter

5.0

°C/W

Junction-to-board characterization parameter

72

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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