TPS62097

SLVSCD6 – DECEMBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVIN, PVIN, EN, VOS, PG

–0.3

6.0

MODE, SS/TR, SW

–0.3

V

FB

–0.3

3.0

Sink current

PG

0

1.0

mA

-40

150

Temperature

°C

–65

150

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommend Operating Conditions

Over operating free-air temperature range, unless otherwise noted.

MIN

MAX

UNIT

Input voltage range

2.5

6.0

V

Pull-up resistor voltage

0

6.0

V

Output voltage range

0.8

V

Output current range

0

2.0

A

Operating junction temperature

-40

125

°C

7.4 Thermal Information

TPS62097xx

UNITS

RWK (11 TERMINALS)

Junction-to-ambient thermal resistance

83.4

°C/W

Junction-to-case (top) thermal resistance

61.0

°C/W

Junction-to-board thermal resistance

19.9

°C/W

Junction-to-top characterization parameter

4.4

°C/W

Junction-to-board characterization parameter

19.9

°C/W

Junction-to-case (bottom) thermal resistance

2.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953

4

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