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NCP508 Datasheet(PDF) 12 Page - ON Semiconductor |
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NCP508 Datasheet(HTML) 12 Page - ON Semiconductor |
12 / 15 page NCP508 http://onsemi.com 12 DEFINITIONS Load Regulation The change in output voltage for a change in output current at a constant temperature. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 125 °C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 150 °C. Depending on the ambient power dissipation and thus the maximum available output current. APPLICATIONS INFORMATION Typical application circuit for the NCP508 series is shown in Figure 1. Input Decoupling (C1) An input capacitor of at least 1.0 mF,(ceramic or tantalum) is recommended to improve the transient response of the regulator and/or if the regulator is located more than a few inches from the power source. It will also reduce the circuit’s sensitivity to the input line impedance at high frequencies. The capacitor should be mounted with the shortest possible track length directly across the regular’s input terminals. Higher values and lower ESR will improve the overall line transient response. Output Decoupling (C2) The NCP508 is a stable regulator and does not require a minimum output current. Capacitors exhibiting ESRs ranging from a few m W up to 3 W can safely be used. The minimum decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. Enable Operation The enable pin will turn on or off the regulator. The limits of threshold are covered in the electrical specification section of this datasheet. If the enable is not used then the pin should be connected to Vin. Hints Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Thermal Considerations Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP508 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: (eq. 1) PD + TJ(max) * TA RqJA where: − TJ{max) is the maximum allowable junction temperature of the die, which is 150 °C − TA is the ambient operating temperature − Rqja is dependent on the surrounding PCB layout |
Número de pieza similar - NCP508_11 |
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Descripción similar - NCP508_11 |
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