TPS65266_16 datasheet(5/41 Pages) TI1

No. de pieza	TPS65266

Descripción Electrónicos	2.7- to 6.5-V Input Voltage, 3-A/2-A/2-A Output Current Triple Synchronous Step-Down Converter

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Fabricante Electrónico	TI1 [Texas Instruments]

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TPS65266

www.ti.com

SLVSCT9B – NOVEMBER 2014 – REVISED JANUARY 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN1, VIN2, VIN3, VINQ

–0.3

7

LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)

–1.0

7

BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively

–0.3

7

Voltage at

V

EN1, EN2, EN3, PGOOD

–0.3

7

FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC

–0.3

3.6

AGND, PGND1, PGND2, PGND3

–0.3

0.3

TJ

Operating junction temperature

–40

150

°C

Tstg

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

Electrostatic

V(ESD)

V

discharge

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN1, VIN2, VIN3, VINQ

2.7

6.5

LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)

–0.8

6.5

Voltage at

BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively

–0.1

6.5

V

EN1, EN2, EN3, PGOOD

–0.1

6.5

FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC

–0.1

3

TJ

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS65266

THERMAL METRIC(1)

RHB

UNIT

32 PINS

RθJA

Junction-to-ambient thermal resistance

34.2

RθJC(top)

Junction-to-case (top) thermal resistance

27.5

RθJB

Junction-to-board thermal resistance

8.3

°C/W

ψJT

Junction-to-top characterization parameter

0.4

ψJB

Junction-to-board characterization parameter

8.3

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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