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TPS799L54 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS799L54 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 22 page TPS799L54, TPS799L57 SBVS191B – APRIL 2012 – REVISED AUGUST 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT IN –0.3 7.0 V Voltage(2) EN –0.3 VIN + 0.3 V OUT –0.3 VIN + 0.3 V Current OUT Internally limited mA Temperature Operating virtual junction, TJ –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –55 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –500 500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2.7 6.5 V IOUT Output current 0.5 200 mA TJ Operating junction temperature –40 125 °C 6.4 Thermal Information TPS799Lxx THERMAL METRIC(1) YZY (DSBGA) UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 143.3 RθJC(top) Junction-to-case (top) thermal resistance 1.1 RθJB Junction-to-board thermal resistance 84.7 °C/W ψJT Junction-to-top characterization parameter 3.8 ψJB Junction-to-board characterization parameter 84.4 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: TPS799L54 TPS799L57 |
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