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TUSB501 Datasheet(PDF) 3 Page - Texas Instruments

No. de Pieza. TUSB501
Descripción  USB 3.0 Single Channel Redriver with Equalization
Descarga  17 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TUSB501 Datasheet(HTML) 3 Page - Texas Instruments

 
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TUSB501
www.ti.com
SLLSEG5A – AUGUST 2013 – REVISED AUGUST 2013
DEVICE CONFIGURATION
Table 1. Control Pin Effects (Typical Values)
PIN
DESCRIPTION
LOGIC STATE
GAIN
Low
3 dB
EQ
Equalization Amount
Floating
6 dB
High
9 dB
OUTPUT DIFFERENTIAL VOLTAGE
PIN
DESCRIPTION
LOGIC STATE
FOR THE TRANSITION BIT
Low
930 mVpp
Output Swing
OS
Amplitude
High
1300 mVpp
DE-EMPHASIS RATIO (1)
PIN
DESCRIPTION
LOGIC STATE
FOR OS = LOW
FOR OS = HIGH
Low
0 dB
–2.6 dB
De-Emphasis
DE
Floating
–3.5 dB
–5.9 dB
Amount
High
–6.2 dB
–8.3 dB
(1)
Typical values
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage range (2)
VCC
–0.5
4
V
Differential I/O
–0.5
4
V
Voltage range at any input or output
terminal
CMOS inputs
–0.5
VCC + 0.5
V
Human body model (all pins) (3)
±5
Electrostatic discharge
kV
Charged-device model (all pins) (4)
±1.5
Storage temperature, TSTG
–65
150
°C
Maximum junction temperature, TJ
-40
105
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to the GND terminals.
(3)
Tested in accordance with JEDEC Standard 22, Test Method A114-B.
(4)
Tested in accordance with JEDEC Standard 22, Test Method C101-A.
THERMAL INFORMATION
TUSB501
THERMAL METRIC(1)
UNITS
DRF
θJA
Junction-to-ambient thermal resistance
102.4
θJC(top)
Junction-to-case(top) thermal resistance
90.3
θJB
Junction-to-board thermal resistance
21.2
°C/W
ψJT
Junction-to-top characterization parameter
70
ψJB
Junction-to-board characterization parameter
3.6
θJC(bottom)
Junction-to-case(bottom) thermal resistance
70.2
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2013, Texas Instruments Incorporated
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