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LM239NG Datasheet(PDF) 9 Page - ON Semiconductor |
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LM239NG Datasheet(HTML) 9 Page - ON Semiconductor |
9 / 11 page LM339, LM339E, LM239, LM2901, LM2901E, LM2901V, NCV2901, MC3302 www.onsemi.com 9 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. H 14 8 7 1 M 0.25 B M C h X 45 SEATING PLANE A1 A M _ S A M 0.25 B S C b 13X B A E D e DETAIL A L A3 DETAIL A DIM MIN MAX MIN MAX INCHES MILLIMETERS D 8.55 8.75 0.337 0.344 E 3.80 4.00 0.150 0.157 A 1.35 1.75 0.054 0.068 b 0.35 0.49 0.014 0.019 L 0.40 1.25 0.016 0.049 e 1.27 BSC 0.050 BSC A3 0.19 0.25 0.008 0.010 A1 0.10 0.25 0.004 0.010 M 0 7 0 7 H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 __ _ _ 6.50 14X 0.58 14X 1.18 1.27 DIMENSIONS: MILLIMETERS 1 PITCH SOLDERING FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. |
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