MC100LVEL11DTG datasheet(4/8 Pages) ONSEMI

No. de pieza	MC100LVEL11DTG

Descripción Electrónicos	ECL 1:2 Differential Fanout Buffer

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MC100LVEL11

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Table 6. AC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 9)

−40

°C

25

°C

95

°C

Symbol

Characteristic

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

fmax

Maximum Toggle Frequency

1.0

GHz

tPLH

tPHL

Propagation Delay to Output

235

385

255

330

405

285

435

ps

tSKEW

Within-Device Skew (Note 10)

Device−to−Device (Note 11)

Duty Cycle Skew (Note 12)

5

10

20

150

20

5

10

20

150

20

5

10

20

150

20

ps

tJITTER

Random Clock Jitter (RMS)

0.6

ps

VPP

Input Swing (Note 13)

200

1000

200

1000

200

1000

mV

tr

tf

Output Rise/Fall Times Q

(20% − 80%)

120

320

120

220

320

120

320

ps

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm.

9.

VEE can vary ±0.3 V.

10. Within-device skew defined as identical transitions on similar paths through a device.

11. Device−to−device skew for identical transitions at identical VCC levels.

12. Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device.

13. VPP(min) is the minimum input swing for which AC parameters guaranteed. The device will function properly with input swings below 200 mV,

however, AC delays may move outside of the specified range. The device has a DC gain of

≈40.

Figure 2. Output Swing versus Frequency

0

200

400

600

800

0

200

400

600

800

1000

1200

1400

1600

1800

2000

f (MHz)

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MC100LVEL11DTG Datasheet(PDF) 4 Page - ON Semiconductor

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