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BD2606MVV-E2 Datasheet(PDF) 11 Page - Rohm

No. de pieza BD2606MVV-E2
Descripción Electrónicos  6-Channel Charge Pump White LED Driver
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Fabricante Electrónico  ROHM [Rohm]
Página de inicio  http://www.rohm.com
Logo ROHM - Rohm

BD2606MVV-E2 Datasheet(HTML) 11 Page - Rohm

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BD2606MVV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
10.Dec.2015 Rev.002
TSZ02201-0G3G0C200400-1-2
2. Recommended PCB Layout
In PCB design, wire the power supply line in a way that the PCB impedance goes low and provide a bypass capacitor if
needed. Heat radiation of back side PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin.
Moreover, connect ground plane of board using via as shown in the patterns of below page.
The efficiency of heat radiation improves according to the area of ground plane.
EN
SCL
To substrate
GND
GND
SDA
To substrate
VCC
C1
C1
VCC
OUT
SDA
SCL
Rear-side GND
EN
Figure 15. Application Layout Image (Top View)
Figure 16. Front (Top View)
3. Application Parts Selection Method
Capacitor (Use a ceramic capacitor with good frequency and temperature characteristics)
Symbol
Recommended Value
Recommended Parts
Type
COUT,CIN,C1,C2
1
μF
GRM188B11A105KA61B(MURATA)
Ceramic capacitor
Connect an input bypass capacitor CIN between IN and GND pin and an output capacitor between OUT and GND pin in
proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip. Furthermore, select a ceramic
capacitor with a sufficient rating for the voltage to be applied.
When other than these parts are used, the equivalent parts must be used.


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