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BD3522EFV Datasheet(PDF) 3 Page - Rohm |
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BD3522EFV Datasheet(HTML) 3 Page - Rohm |
3 / 27 page 3/23 BD3522EFV © 2015 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111・15・001 TSZ02201-0J2J0A601000-1-2 02.Nov.2015 Rev.001 Description of Blocks –continued 6. NRCS (Non Rush Current on Start-up) The soft start function enabled by connecting an external capacitor between the NRCS pin and GND. Output ramp-up can be set for any period up to the time the NRCS pin reaches VFB (0.65V). During startup, the NRCS pin serves as a 20 μA (TYP) constant current source to charge the external capacitor. Output start time is calculated by the formula below. NRCS FB NRCS NRCS I V C typ t 7. TSD (Thermal Shut down) The shutdown (TSD) circuit is automatically latched OFF when the chip temperature exceeds the threshold temperature after the programmed time period elapses, thus protecting the IC against “thermal runaway” and heat damage. Since the TSD circuit is designed only to shut down the IC in the occurrence of extreme heat, it is important that the Tj (max) parameter should not be exceeded in the thermal design, in order to avoid potential problems with the TSD. A V C typ t SCPTH SCP TSD 20 8. IN The IN line acts as the major current supply line, and is connected to the output N-Channel FET drain. Since there is no electrical connection (such as between the VCC pin and the ESD protection diode) required, IN operates independent of the input sequence. However, since an output N-Channel FET body diode exists between IN and OUT, a VIN-VOUT electric (diode) connection is present. Therefore, when output is switched ON or OFF, reverse current may flow from OUT to IN. 9. SCP When output voltage (OUT) drops, the IC assumes that OUT pin is shorted to GND and switches the output voltage OFF. After the GND short has been detected and the programmed delay time has elapsed, the output is latched OFF. SCP is also effective during output startup. SCP condition can be cleared either by reconnecting the EN pin or VCC pin. Delay time is calculated by the formula below. Absolute Maximum Ratings(Ta=25°C) Parameter Symbol Limit Unit Input Voltage 1 VCC 6.0 (Note 1) V Input Voltage 2 VIN 6.0 (Note 1) V Maximum Output Current IOUT 4(Note 1) A Enable Input Voltage VEN 6.0 V Power Dissipation 1 Pd1 1.00 (Note 2) W Power Dissipation 2 Pd2 1.45 (Note 3) W Power Dissipation 3 Pd3 2.31 (Note 4) W Power Dissipation 4 Pd4 3.20 (Note 5) W Operating Temperature Range Topr -10 to +100 °C Storage Temperature Range Tstg -55 to +125 °C Maximum Junction Temperature Tjmax +150 °C (Note 1) Should not exceed Pd. (Note 2) Derate by 8mW/°C for Ta above 25°C (when mounted on a 70mm x 70mm x 1.6mm glass-epoxy board, no copper foil area) (Note 3) Derate by 11.6mW/°C for Ta above 25°C (when mounted on a 70mm x 70mm x 1.6mm glass-epoxy board, 2-layer, copper foil area : 15mm x 15mm) (Note 4) Derate by 18.5mW/°C for Ta above 25°C (when mounted on a 70mm x 70mm x 1.6mm glass-epoxy board, 2-layer, copper foil area : 70mm x 70mm) (Note 5) Derate by 25.6mW/°C for Ta above 25°C (when mounted on a 70mm x 70mm x 1.6mm glass-epoxy board, 4-layer, copper foil area : 70mm x 70mm) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. SCP SCPTH SCP SCP I V C typ t |
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