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FHA1105P-TR Datasheet(PDF) 8 Page - STANLEY ELECTRIC CO.,LTD.

No. de Pieza. FHA1105P-TR
Descripción  1005(t=0.25mm) Type, water clear lens
Descarga  21 Pages
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Fabricante  STANLEY [STANLEY ELECTRIC CO.,LTD.]
Página de inicio  http://www.stanley.co.jp/e/
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FHA1105P-TR Datasheet(HTML) 8 Page - STANLEY ELECTRIC CO.,LTD.

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F□□1105P-TR
Soldering condition
1.
Heat stress during soldering will greatly influence the reliability of LEDs, however that effect will vary
on heating method. Also, if components of varying shape are soldered together, it is recommended to
set the soldering pad temperature according to the component most vulnerable to heat stress (ex.
SMT LED). (Recommended Condition: Soldering Pad temp. > Package temp.)
2.
Because LED parts including the resin are not stable immediately after soldering ( when they are not at
room temperature), any mechanical stress may cause damage to the product. Please avoid such stress
after soldering, especially stacking of the boards which may cause the boards to warp and any other
types of friction with hard materials.).
3.
Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin
surface. Temperature distribution varies on heating method, PCB material, other components in the
assembly, and mounting density .
Please do not repeat the heating process in Reflow process more than twice.
2012/10/30
【Soldering Precaution】
(acc.to EIAJ-4701/300)
【Recommended Reflow Soldering Condition.】
40sec MAX.
150℃~180℃
+1.5~+5℃/s
260℃ MAX.
-1.5~-5℃/s
90~120sec MAX.
Pre-heating
(Soldering
230℃ MAX.
Peak Temperature
Note 1 Temperature Profile for the reflow soldering is listed as the temperature of resin surface. This
represents the maximum temperature ratings for soldering. Lowering the heating temperature and
decreasing heating time is very effective in ensuring higher reliability.
Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is
performed, interval between first and second process should be as short as possible to prevent absorption
of moisture to resin of LED. The second soldering process should not be done until LEDs have returned to
room temperature (by nature-cooling) after first soldering process.
Page : A-1


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