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ADC32RF83IRMPR Datasheet(PDF) 5 Page - Texas Instruments |
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ADC32RF83IRMPR Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 136 page  5 ADC32RF80, ADC32RF83 www.ti.com SBAS774A – MAY 2016 – REVISED DECEMBER 2016 Product Folder Links: ADC32RF80 ADC32RF83 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage range AVDD19 –0.3 2.1 V AVDD –0.3 1.4 DVDD –0.3 1.4 Voltage applied to input pins INAP, INAM and INBP, INBM –0.3 AVDD19 + 0.3 V CLKINP, CLKINM –0.3 AVDD + 0.6 SYSREFP, SYSREFM, SYNCBP, SYNCBM –0.3 AVDD + 0.6 SCLK, SEN, SDIN, RESET, PDN, GPIO1, GPIO2, GPIO3, GPIO4 –0.2 AVDD19 + 0.2 Voltage applied to output pins –0.3 2.2 V Temperature Operating free-air, TA –40 85 °C Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) Always power up the DVDD supply (1.15 V) before the AVDD19 (1.9 V) supply. The AVDD (1.15 V) supply can come up in any order. (2) Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage(1) AVDD19 1.8 1.9 2.0 V AVDD 1.1 1.15 1.25 DVDD 1.1 1.15 1.2 Temperature Operating free-air, TA –40 85 °C Operating junction, TJ 105(2) 125 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) ADC32RF80 UNIT RMP (VQFN) 72 PINS RθJA Junction-to-ambient thermal resistance 21.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 4.4 °C/W RθJB Junction-to-board thermal resistance 2.0 °C/W ψJT Junction-to-top characterization parameter 0.1 °C/W ψJB Junction-to-board characterization parameter 2.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.2 °C/W |
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