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TPSM84A21MOJT Datasheet(PDF) 4 Page - Texas Instruments |
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TPSM84A21MOJT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page 4 TPSM84A21 SLVSDF7 – DECEMBER 2016 www.ti.com Product Folder Links: TPSM84A21 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves, ensures that the maximum junction temperature of any component inside the module is never exceeded. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input voltage VIN –0.3 15 V EN/UVLO –0.3 7 V PGOOD, SYNC, VG –0.3 6 V ILIM, VADJ, VS+ –0.3 3 V PGND –0.3 0.3 V Output voltage VOUT –0.3 3 V Source current EN/UVLO 100 µA Sink current VG 100 mA PGOOD 4 mA Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 500 G Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20 G Operating IC junction temperature, TJ (2) –40 125 °C Operating ambient temperature, TA (2) –40 85 °C Storage temperature, Tstg –55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves, ensures that the maximum junction temperature of any component inside the module is never exceeded. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 8 14 V VOUT Output voltage 0.55 1.35 V VVG Gate drive voltage 5.0 5.5 V VEN EN voltage 0 5.5 V VPGOOD PGOOD pull-up voltage 0 5.5 V VSYNC SYNC voltage 0 5.5 V IOUT Output current 0 10 A TJ Operating IC junction temperature (1) –40 125 °C TA Operating ambient temperature (1) –40 85 °C |
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