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SDP600-25Pa Datasheet(PDF) 8 Page - List of Unclassifed Manufacturers |
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SDP600-25Pa Datasheet(HTML) 8 Page - List of Unclassifed Manufacturers |
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8 / 10 page  www.sensirion.com Version 1.9 – July 2015 8/10 8. Instructions for Use 8.1 Soldering instructions Standard wave soldering systems may be used for soldering SDP600 series sensors. Reflow soldering is not feasible and may damage the sensor. The sensor ports must be protected from solder splash and flux during soldering. Figure 6 shows an appropriate temperature profile with maximum temperature values. Figure 6: Suitable wave soldering profile. The characteristics of wave soldering machines vary, so any soldering setup must be tested before production use. 8.2 Sensor handling The sensors of the SDP600 series are designed to be robust and vibration resistant. Nevertheless, the accuracy of the high-precision SDP600 series can be degraded by rough handling. Sensirion does not guarantee proper operation in case of improper handling. Note: avoid applying any mechanical stress to the solder joints of the sensor during or as a result of PCB assembly. The sensor ships in an antistatic package to prevent electrostatic discharge (ESD), which can damage the part. To avoid such damage, ground yourself using a grounding strap or by touching a grounded object. Furthermore store the parts in the antistatic package when not in use. 8.3 Additional attachment If necessary, the robustness of the sensor attachment to the PCB can be increased by using a bracket as shown in Figure 7. Sensirion recommends using this additional bracket when the sensor is fitted to a PCB. The bracket must be secured before the pins are soldered to the PCB, as otherwise sensor performance may be degraded by mechanical stress. Figure 7: Supplementary bracket for the SDP600 series. 8.4 Air flow and tubing Due to the dynamic measurement principle, a small air flow is required. Figure 8:Typical air flow through the SDP600 series sensor. Note: 1 sccm = 1 cm3/min at 0°C and 1013 mbar (1 sccm = 0.001 standard liter). This air flow through the sensor creates a dependence on the tube length. The error is less than 1% with a tube length up to 1 m (with 3/16 inch inside diameter). 0 -120 +120 -600 +600 0 Pressure difference (Pa) 200°C 150°C 100°C 50°C 0°C 250°C Start Flux zone Preheat zone Entrance to solder Wave Exit from solder Wave Solder Wave Peak Temp. max. 260°C Max 145°C Approx. PCB bottom-side temp. PCB top-side temperature Approx. 1 min (Time in wave < 2 s) |
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