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LM6161 Datasheet(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No. de pieza LM6161
Descripción Electrónicos  High Speed Operational Amplifier
Download  11 Pages
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Fabricante Electrónico  NSC [National Semiconductor (TI)]
Página de inicio  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM6161 Datasheet(HTML) 3 Page - National Semiconductor (TI)

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DC Electrical Characteristics (Continued)
The following specifications apply for Supply Voltage = ±15V, V
CM = 0, RL ≥ 100 kΩ and RS = 50Ω unless otherwise noted.
Boldface limits apply for T
J = TMIN to TMAX; all other limits TJ = 25˚C.
Symbol
Parameter
Conditions
Typ
LM6161
LM6261
LM6361
Units
Limit
Limit
Limit
(Notes 3, 11)
(Note 3)
(Note 3)
V
O
Output Voltage
Supply = ±15V
+14.2
+13.5
+13.5
+13.4
Volts
Swing
and R
L = 2kΩ
+13.3
+13.3
+13.3
Min
−13.4
−13.0
−13.0
−12.9
Volts
−12.7
−12.8
−12.8
Min
Supply = +5V
4.2
3.5
3.5
3.4
Volts
and R
L = 2kΩ
3.3
3.3
3.3
Min
(Note 4)
1.3
1.7
1.7
1.8
Volts
2.0
1.9
1.9
Max
Output Short
Source
65
30
30
30
mA
Circuit Current
20
25
25
Min
Sink
65
30
30
30
mA
20
25
25
Min
I
S
Supply Current
5.0
6.5
6.5
6.8
mA
6.8
6.7
6.9
Max
AC Electrical Characteristics
The following specifications apply for Supply Voltage = ±15V, V
CM = 0, RL ≥ 100 kΩ and RS = 50Ω unless otherwise noted.
Boldface limits apply for T
J = TMIN to TMAX; all other limits TJ = 25˚C.
LM6161
LM6261
LM6361
Symbol
Parameter
Conditions
Typ
Limit
Limit
Limit
Units
(Notes 3, 11)
(Note 3)
(Note 3)
GBW
Gain-Bandwidth
@ f = 20 MHz
50
40
40
35
MHz
Product
30
35
32
Min
Supply = ±5V
35
MHz
SR
Slew Rate
A
V = +1 (Note 8)
300
200
200
200
V/µs
180
180
180
Min
Supply = ±5V (Note 8)
200
V/µs
PBW
Power Bandwidth
V
OUT = 20 VPP
4.5
MHz
t
S
Settling Time
10V Step to 0.1%
120
ns
A
V = −1, RL = 2kΩ
φm
Phase Margin
45
Deg
A
D
Differential Gain
NTSC, A
V = +4
<0.1
%
φD
Differential Phase
NTSC, A
V = +4
0.1
Deg
e
np-p
Input Noise Voltage
f = 10 kHz
15
i
np-p
Input Noise Current
f = 10 kHz
1.5
Note 1: Continuous short-circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C.
Note 2: The typical junction-to-ambient thermal resistance of the molded plastic DIP (N) is 105˚C/W, the molded plastic SO (M) package is 155˚C/W, and the cerdip
(J) package is 125˚C/W. All numbers apply for packages soldered directly into a printed circuit board.
Note 3: Limits are guaranteed by testing or correlation.
Note 4: For single supply operation, the following conditions apply: V+ = 5V, V= 0V, VCM = 2.5V, VOUT = 2.5V. Pin 1 & Pin 8 (Vos Adjust) are each connected to
Pin4(V) to realize maximum output swing. This connection will degrade VOS,VOS Drift, and Input Voltage Noise.
Note 5: CL ≤ 5pF.
Note 6: In order to achieve optimum AC performance, the input stage was designed without protective clamps. Exceeding the maximum differential input voltage re-
sults in reverse breakdown of the base-emitter junction of one of the input transistors and probable degradation of the input parameters (especially Vos, Ios, and
Noise).
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