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LM66 Datasheet(PDF) 3 Page - National Semiconductor (TI) |
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LM66 Datasheet(HTML) 3 Page - National Semiconductor (TI) |
3 / 5 page LM66 Electrical Characteristics The following specifications apply for V + = 2.7 V DC, and VREF load current = 50 µA unless otherwise specified. Boldface lim- its apply for T A =TJ =TMIN to TMAX; all other limits TA =TJ = 25˚C unless otherwise specified. Symbol Parameter Conditions Typical Limits Units (Note 6) (Note 7) (Limits) V + Power Supply I S Supply Current V + = +10V 250 µA (max) V + = +2.7V 250 µA (max) Digital Output(s) I OUT(“1”) Logical “1” Output Leakage Current V + = +5.0V 1 µA (max) V OUT(“0”) Logical “0” Output Voltage I OUT = +50 µA 0.4 V (max) Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func- tional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed speci- fications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 2: When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V +), the current at that pin should be limited to 5 mA. The 20 mA maxi- mum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to am- bient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD =(TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 125˚C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow: Package Type θ JA M08A 110˚C/W Note 4: The human body model is a 100 pF capacitor discharge through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Note 5: See AN450 “Surface Mounting Methods and Their Effects on Product Reliability” or the section titled “Surface Mount” found in any post 1986 National Semi- conductor Linear Data Book for other methods of soldering surface mount devices. Note 6: Typicals are at TJ =TA = 25˚C and represent most likely parametric norm. Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). www.national.com 3 |
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