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LMS5214IMG-2.5 Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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LMS5214IMG-2.5 Datasheet(HTML) 4 Page - National Semiconductor (TI) |
4 / 10 page Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance (Note 2) Human Body Model 2000V Machine Model 200V Junction Temperature 150˚C V IN,VOUT,VEN −0.3 TO 6.5V Soldering Information Infrared or Convection (20 sec) 235˚C Wave Soldering (10 sec) 260˚C (lead temp) Operating Ratings Supply Voltages V IN 2.5V to 6V V EN 0V to V IN Junction Temp. Range (Note 3) −40˚C to +125˚C Storage Temperature Range −65˚C to 150˚C Package Thermal Resistance SC70-5 478˚C/W Electrical Characteristics Unless otherwise specified, all limits guaranteed for T J = 25˚C, VIN =VOUT + 1V, IL = 1mA, CL = 0.47µF, V EN ≥ 2.0V. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (Note 5) Typ (Note 4) Max (Note 5) Units V O Output Voltage Accuracy -3 -4 3 4 % ∆V O/ ∆T Output Voltage Temp. Coefficient (Note 10) 50 200 ppm/˚C ∆V O/VO Line Regulation V IN =VOUT +1V to 6V 0.008 0.3 0.5 % ∆V O/VO Load Regulation I L = 0.1mA to 80mA (Note 6) 0.08 0.3 0.5 % V IN-VO Dropout Voltage (Note 7) I L = 100µA 2 mV I L = 20mA 70 150 I L = 50mA 180 I L = 80mA 300 500 I Q Quiescent Current V EN ≤ 0.4V (Shutdown) 10 100 nA I GND Ground Pin Current I L = 100µA, VEN ≥ 2.0V (active) 70 µA I L = 20mA, VEN ≥ 2.0V (active) 80 135 I L = 80mA, VEN ≥ 2.0V (active) 110 200 I LIMIT Current Limit V OUT = 0V 200 400 mA ∆V O/ ∆P D Thermal Regulation (Note 9) 0.05 %W Enable Input V IL Enable Input Voltage Level Logic Low (off) 0.6 V V IH Logic High (on) 2.0 V I IL Enable Input Current V IL ≤ 0.6V 0.01 1 µA I IH V IH ≥ 2.0V 0.01 5 µA Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 2: Human body model, 1.5k Ω in series with 100pF. Note 3: The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD =(TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Note 4: Typical Values represent the most likely parametric norm. Note 5: All limits are guaranteed by testing or statistical analysis. Note 6: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Note 8: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Note 9: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for an 80mA load pulse at VIN = 6V for t = 16ms. Note 10: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range. www.national.com 4 |
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