BAS16WT1G

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5

PACKAGE DIMENSIONS

SC−70 (SOT−323)

CASE 419−04

ISSUE N

A

A2

D

e1

b

e

E

A1

c

L

3

12

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

0.05 (0.002)

1.9

0.075

0.65

0.025

0.65

0.025

0.9

0.035

0.7

0.028

mm

inches

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

0.80

0.90

1.00

0.032

INCHES

A1

0.00

0.05

0.10

0.000

A2

0.70 REF

b

0.30

0.35

0.40

0.012

c

0.10

0.18

0.25

0.004

D

1.80

2.10

2.20

0.071

E

1.15

1.24

1.35

0.045

e

1.20

1.30

1.40

0.047

0.035

0.040

0.002

0.004

0.014

0.016

0.007

0.010

0.083

0.087

0.049

0.053

0.051

0.055

NOM

MAX

L

2.00

2.10

2.40

0.079

0.083

0.095

e1

0.65 BSC

0.38

0.028 REF

0.026 BSC

0.015

0.20

0.56

0.008

0.022

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