BAS19L, BAS20L, BAS21L, BAS21DW5

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2

THERMAL CHARACTERISTICS (SOT−23)

Characteristic

Symbol

Max

Unit

Total Device Dissipation FR−5 Board

(Note 2)

Derate above 25

°C

225

1.8

mW

mW/

°C

Thermal Resistance

Junction−to−Ambient (SOT−23)

556

°C/W

Total Device Dissipation Alumina Substrate

(Note 3)

Derate above 25

°C

300

2.4

mW

mW/

°C

Thermal Resistance Junction−to−Ambient

417

°C/W

Junction and Storage

Temperature Range

−55 to +150

°C

THERMAL CHARACTERISTICS (SC−88A)

Characteristic

Symbol

Max

Unit

Power Dissipation (Note 4)

385

mW

Thermal Resistance −

Junction−to−Ambient

Derate Above 25

°C

328

3.0

°C/W

mW/

°C

Maximum Junction Temperature

150

°C

Operating Junction and Storage Temperature Range

−55 to +150

°C

2. FR−5 = 1.0

0.75

0.062 in.

3. Alumina = 0.4

0.3

0.024 in. 99.5% alumina.

4. Mounted on FR−5 Board = 1.0 x 0.75 x 0.062 in.

Characteristic

Symbol

Min

Max

Unit

Reverse Voltage Leakage Current

BAS19

BAS20

BAS21

BAS19

BAS20

BAS21

−

−

−

−

−

−

0.1

0.1

0.1

100

100

100

mAdc

Reverse Breakdown Voltage

BAS19

BAS20

BAS21

120

200

250

−

−

−

Vdc

Forward Voltage

−

−

1.0

1.25

Vdc

−

5.0

pF

−

50

ns

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.