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HLMP-NL06 Datasheet(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED

No. de pieza HLMP-NL06
Descripción Electrónicos  High brightness light output
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Fabricante Electrónico  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Página de inicio  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-NL06 Datasheet(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED

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Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• CaremustbetakenduringPCBassemblyandsoldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
• Wavesolderingparametermustbesetandmaintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes
for LED component leads:
LED Component
Lead Size
Diagonal
Plated Through
-Hole Diameter
Lead size (typ.)
0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
0.98 to 1.08 mm
(0.039 to 0.043 in)
Dambar shear-
off area (max.)
0.65 mm
(0.026 in)
0.919 mm
(0.036 in)
Lead size (typ.)
0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Dambar shear-
off area (max.)
0.70 mm
(0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information on
soldering LED components.
Figure 7. Recommended wave soldering profile.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4257EN
AV02-1014EN - July 14, 2014
LAMINAR WAVE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0
10
20
30
50
100
150
200
250
30
40
50
TIME – SECONDS
60
70
80
90
100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
Wave Soldering
Dipping
Manual Solder
Pre-heat Temperature
105 °C Max.
Pre-heat Time
30 sec Max.
Peak Temperature
250 °C Max.
260 °C Max.
Dwell Time
3 sec Max.
5 sec Max.


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